Tag Archives: World’s
World’s first ultra-fast PCIe 6.0 SSD arrives, but it’s not for you
Image: MicronMove over, PCI Express 5.0! Micron has shipped the first PCI Express 6.0 SSD, ramping up read and write speeds to unprecedented levels. The bad news? It’s not for PCs.
This week, Micron shipped the Micron 9650 SSD, the world’s first PCIe 6.0 SSD, designed for AI training and inference workloads. Unfortunately, those tasks take place in AI data centers, not home PCs.
Micron will ship the drive in both a PRO (read-intensive) and MAX (write-intensive) configuration, with capacities ranging from 6.4TB to 30.72TB, depending on which flavor a customer buys.
Technically, the drives use a PCI Express 6.2 interface, connecting to Micron’s six-plane, ninth-generation (G9) flash memory. The kicker, though, is the performance. The Micron 9650 SSD family performs sequential reads of 28,000 MB/s and sequential writes of 14,000 MB/s (which is 100 percent higher and...
PM Modi Retains Top Spot as World’s Most Popular Leader With 69% Rating: Survey | Republic World
Top Stories Tamfitronics Published 18:31 IST, August 3rd 2024 PM Modi Retains Top Spot as World's Most Popular Leader With 69% Rating: Survey Top Stories Tamfitronics PM Modi has maintained his position as the world's most popular leader, outshining US President Joe Biden. India News 2 min read Reported by: Digital Desk Follow: PM Narendra Modi (File Photo) | Image: @NarendraModi-FB Listen to this article 2 min read Advertisement 18:31 IST, August 3rd 2024
This is the chip that could feature in the world’s largest SSD — Kioxia launches 2Tb NAND chip and key partner Pure Storage may use it in its 150TB SSD DirectFlash modules
Technology tamfitronics Japanese memory giant Kioxia says it has begun sampling shipments of 2Tb QLC devices, utilizing its eighth-generation BiCS FLASH 3D flash memory technology.This new chip will be used in SSDs, servers, and other forms of digital storage hardware that require high-capacity, high-efficiency memory components.Kioxia's BiCS FLASH technology expands the memory die vertically and laterally, while the integration of CBA (CMOS directly Bonded to Array) technology supports denser memory creation and interface speeds of up to 3.6Gbps. The new product features a bit density about 2.3 times higher than Kioxia's previous fifth-generation QLC device and 70% greater write power efficiency. With a 16-die stacked architecture in a single memory package, Kioxia says its new QLC device can achieve 4TB capacity.Pure Storage to adopt the technologyHideshi Miyajima, Chief Technology Officer of Kioxia, said, “With its...
